Intel is running with DDR5-6000 C元0, whereas the Ryzen is tested with DDR5-6400 C元2-lower latency for Intel, higher MHz for Ryzen. It's worth mentioning that the memory configurations are slightly mismatched. Here we see the Ryzen 7000 chip finish the task in 204 seconds, compared to the i9-12900K and its 297 seconds time, which is a huge 31% difference-very impressive. The comparison runs the Blender rendering software, which loads all CPU cores. In the presentation we're seeing a live demo comparison between a "Ryzen 7000 Series" processor and Intel's Core i9-12900K "Alder Lake." It's worth mentioning here that AMD isn't disclosing the exact processor model, only that it's a 16-core part, if we follow the Zen 3 naming, that would probably be the Ryzen 9 7950X flagship. The footnotes also reference a "RPL-003" claim that's not used anywhere in our pre-briefing slide deck, but shown in the video presentation. For desktop this means the ability to address a higher number of VRM phases and to process voltage changes much faster than with SVI2 on AM4. In terms of power delivery Zen 4 uses the same SVI3 voltage control interface that we saw introduced on the Ryzen Mobile 6000 Series. DirectStorage enables direct transfers between a storage device and the GPU memory, without the data having to route through the CPU cores. The new AMD Smart Access Storage technology builds on Microsoft DirectStorage, by adding AMD platform-awareness, and optimization for AMD CPU and GPU architectures. AMD showcased a handful, including the ASUS ROG Crosshair X670E Extreme, the ASRock X670E Taichi, MSI MEG X670E ACE, GIGABYTE X670E AORUS Xtreme, and the BIOSTAR X670E Valkyrie.ĪMD is working to introduce several platform-level innovations like it did with Smart Access Memory with its Radeon RX 6000 series, which builds on top of the PCIe Resizable BAR technology by the PCI-SIG. The B650 chipset is designed to offer Gen 4 PCIe PEG, Gen 5 CPU-attached NVMe, and likely Gen 3 connectivity from the chipset.Īll major motherboard vendors are ready with Socket AM5 motherboards.
The X670 (non-extreme), is very likely a rebadged X570, which means you get up to 20 Gen 4 PCIe lanes from the chipset, while retaining PCIe Gen 5 PEG and CPU-attached NVMe connectivity. The X670 Extreme was probably made by re-purposing the new-generation 6 nm cIOD die to work as a motherboard chipset, which means its 24 PCIe Gen 5 lanes work toward building an "all Gen 5" motherboard platform.
#ZEN 4 DDR5 BLUETOOTH#
The company will also standardize Wi-Fi 6E + Bluetooth WLAN solutions it co-developed with MediaTek, weaning motherboard designers away from Intel-made WLAN solutions.Īt its launch, in Fall 2022, AMD's AM5 platform will come with three motherboard chipset options-the AMD X670 Extreme (X670E), the AMD X670, and the AMD B650. With onboard graphics now making it to most processor models, motherboards will feature up to four DisplayPort 2 or HDMI 2.1 ports. The platform also puts out up to 14 USB 20 Gbps ports, including type-C. The cIOD packs a pleasant surprise-an iGPU based on the RDNA2 graphics architecture! Now most Ryzen 7000 processors will pack integrated graphics, just like Intel Core desktop processors. The "Zen 4" CPU core is larger, on account of more number-crunching machinery to achieve the IPC increase and new instruction-sets, as well as the larger per-core L2 cache. The leap to 5 nm for the CCD enables AMD to cram up to 16 "Zen 4" cores per socket, all of which are "performance" cores.
#ZEN 4 DDR5 UPGRADE#
The CCDs are built on the 5 nm silicon fabrication process, while the I/O die is built on the 6 nm process, a significant upgrade from previous-generation I/O dies that were built on 12 nm. Much like Ryzen 3000 "Matisse," and Ryzen 5000 "Vermeer," the Ryzen 7000 "Raphael" desktop processor is a multi-chip module with up to two "Zen 4" CCDs (CPU core dies), and one I/O controller die. The transition to the LGA1718 Socket AM5 allows AMD to use next-generation I/O, including DDR5 memory, and PCI-Express Gen 5, both for the graphics card, and the M.2 NVMe slot attached to the CPU socket. With Zen 4, AMD is introducing a new instruction set for AI compute acceleration.
#ZEN 4 DDR5 PLUS#
Based on the way AMD has worded their claims, it seems that the "+15%" number includes IPC gains, plus gains from higher clocks, plus what the DDR4 to DDR5 transition achieves. Other key specs about the architecture put out by AMD include a doubling in per-core L2 cache to 1 MB, up from 512 KB on all older versions of "Zen." The Ryzen 7000 desktop CPUs will boost to frequencies above 5.5 GHz.
#ZEN 4 DDR5 SERIES#
The new Ryzen 7000 series processors introduce the new "Zen 4" microarchitecture, with the company claiming a 15% single-threaded uplift over "Zen 3" (16-core/32-thread Zen 4 processor prototype compared to a Ryzen 9 5950X). AMD today unveiled its next-generation Ryzen 7000 desktop processors, based on the Socket AM5 desktop platform.
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